Nexus

Application

Semiconductor wafer cleaning, Point of Use Heating (POU)

Materials

Performance

Wattages 500 kW to 1400 kW

Specifications

Inlets: Low Flow: 6.3mm (¼”) SP300 Nippon Pillar High Flow: 6.3mm (¼”) SMC Hyperflare. Outlets: Low Flow: 3.1mm(1/8”) SP300 Nippon Pillar High Flow: 3.1mm (1/8”) SMC Hyperflare.

Features

- Reduced complexity: One set of controls for up to four process chambers. Small space requirements

- Designed for performance Allows for precise and stable temperature control for multiple chambers, Low watt density design for lower surface temperatures

- Engineered for Safety: Heats chemicals and flammable solvents through indirect contact, Patented purged housing for leak detection

- Advanced Cleanliness: O-ring free and crevice free design eliminates source for contamination, all PFA wetted surfaces for acids and solvents.

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Multi-loop chemical heater.

Engineered for your process - manage multiple chambers with one precise and stable heater! Building off of the popular SHC product line, the Nexus incorporates the same safe indirect heating technology to heat multiple process loops. Using a single heat source, the Nexus improves chamber-temperature matching performance for advanced processing requirements. PFA wetted surfaces. Low-watt denisty design for lower surface temperatures. Heats up to 176°F (80°C).

Safety: RTD core sensors Bi-mettalic over-temp sensor.

Process Technology Product Bulletin

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