XC High-Flow

Application

Semiconductor wafer cleaning

Materials

Polypro, Kynar PVDF, PTFE

Performance

Varies on materials

Specifications

Tube, Shell, & Drain: Flared connections standard, choose sizes and other options when ordering (see model tree in product bulletin)

Features

- High-flow Capacity: Large diameter tubing improves flow circulation, high-flow option further reduces pressure drop, reduces sizing requirements for associated equipment

- Low-Mass Heat Exchanger: Enables faster temperature response, Allows for precise and stable temperature control

- Ultra-High-Purity: Chemistry fluid path made from high grade PFA components, No wetted o-ring seals eliminate source for contamination, assembled and tested in a clean-room environment

- Compact Design: Reduces tool design space requirements, Facilitates retrofitting of existing tools, Simplifies manufacturing complexity

Quote Request

Ultra-high purity, high-flow heat exchanger

The XC inline heat exchanger is now available with a high-flow option that provides the same heat transfer performance as before but now with a reduced fluid pressure drop. With a PFA tube-side fluid path the XC Series will meet the most stringent cleanliness requirements to support next-generation ultra-high-purity (UHP) semiconductor node technologies. This exchanger supports both recirculating and single pass flow applications. Heats up to 275°F (135°C)

13mm (0.5 inch) PFA tubing, 0.76mm (0.030 inch) wall thickness All welded construction (shell) 147.5mm (5.8125 inch) diameter polypropylene or PVDF shell Internally baffled for enhanced heat performance U” factor (depending on flow rate): 142-284 J/(s x m2 x °C) = 25-50 BTU/(hr x ft2x F) Shell-side drain connection

Options: 19mm (0.75 inch) Super 300 Pillar Type connection Custom sizes based on application Heavy-wall PFA tubing, 15.7mm (0.062 inch) wall thickness

Process Technology Product Bulletin

Download file

Category